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? semiconductor components industries, llc, 2008 may, 2008 ? rev. 16 1 publication order number: mc33275/d mc33275, ncv33275 300 ma, low dropout voltage regulator the mc33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, sot ? 223, sop ? 8, dpak, and dfn 4x4 surface mount packages. these devices feature a very low quiescent current and are capable of supplying output currents up to 300 ma. internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. due to the low input ? to ? output voltage dif ferential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. features ? low input ? to ? output v oltage differential of 25 mv at i o = 10 ma, and 260 mv at i o = 300 ma ? extremely tight line and load regulation ? stable with output capacitance of only 0.33 f for 2.5 v output voltage ? internal current and thermal limiting ? ncv prefix for automotive and other applications requiring site and control changes ? pb ? free packages are available applications ? battery powered consumer products ? hand ? held instruments ? camcorders and cameras figure 1. simplified block diagram v in thermal & anti ? sat protection 54 k rint this device contains 41 active transistors 1.23 v v. ref. v out gnd low dropout micropower voltage regulator soic ? 8 d suffix case 751 sot ? 223 st suffix case 318e 4 1 ordering information see detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. xx = voltage version a = assembly location l = wafer lot y = year w, ww = work week or g = pb ? free device (note: microdot may be in either location) http://onsemi.com marking diagrams 3 1 3 4 dpak ? 3 dt suffix case 369a 1 275xxg alyww 1 8 dfn ? 8, 4x4 mn suffix case 488af 275xx alyw 1 1 275xx alyw 1 8 1 ayw 275xx
mc33275, ncv33275 http://onsemi.com 2 pin connections gnd v in v out 4 12 3 gnd gnd v in v out 4 123 gnd input gnd gnd n/c output gnd gnd n/c pins 4 and 5 not connected mc33275st 1 2 3 4 8 7 6 5 mc33275d mc33275dt ?? ?? ?? ?? ?? ? ? ? ? ? maximum ratings rating symbol value unit input voltage v cc 13 vdc power dissipation and thermal characteristics t a = 25 c maximum power dissipation case 751 (soic ? 8) d suffix thermal resistance, junction ? to ? ambient thermal resistance, junction ? to ? case case 318e (sot ? 223) st suffix thermal resistance, junction ? to ? air thermal resistance, junction ? to ? case case 369a (dpak ? 3) dt suffix thermal resistance, junction ? to ? air thermal resistance, junction ? to ? case case 488af (dfn ? 8, 4x4) mn suffix thermal resistance, junction ? to ? air (with 1.0 oz pcb cu area) thermal resistance, junction ? to ? air (with 1.8 oz pcb cu area) thermal resistance, junction ? to ? case p d r ja r jc r ja r jc r ja r jc r ja r ja psi ? jc* internally limited 160 25 245 15 92 6.0 183 93 9.0 w c/w c/w c/w c/w c/w c/w c/w c/w c/w output current i o 300 ma maximum junction temperature t j 150 c operating ambient temperature range t a ? 40 to +125 c storage temperature range t stg ? 65 to +150 c electrostatic discharge sensitivity (esd) human body model (hbm) machine model (mm) esd 4000 400 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. *?c?? (?case??) is defined as the solder ? attach interface between the center of the exposed pad on the bottom of the package, and the board to which it is attached.
mc33275, ncv33275 http://onsemi.com 3 electrical characteristics (c l = 1.0 f, t a = 25 c, for min/max values t j = ? 40 c to +125 c, note 1) characteristic symbol min typ max unit output voltage i o = 0 ma to 250 ma 2.5 v suffix t a = 25 c, v in = [v o + 1] v 3.0 v suffix 3.3 v suffix 5.0 v suffix 2.5 v suffix v in = [v o + 1] v, 0 < i o < 100 ma 3.0 v suffix 2% tolerance from t j = ? 40 to +125 c 3.3 v suffix 5.0 v suffix v o 2.475 2.970 3.267 4.950 2.450 2.940 3.234 4.900 2.50 3.00 3.30 5.00 ? ? ? ? 2.525 3.030 3.333 5.05 2.550 3.060 3.366 5.100 vdc line regulation v in = [v o + 1] v to 12 v, i o = 250 ma, all suffixes t a = 25 c reg line ? 2.0 10 mv load regulation v in = [v o + 1] v, i o = 0 ma to 250 ma, all suffixes t a = 25 c reg load ? 5.0 25 mv dropout voltage i o = 10 ma t j = ? 40 c to +125 c i o = 100 ma i o = 250 ma i o = 300 ma v in ? v o ? ? ? ? 25 115 220 260 100 200 400 500 mv ripple rejection (120 hz) v in(peak ? peak) = [v o + 1.5] v to [v o + 5.5] v ? 65 75 ? db output noise voltage c l = 1.0 fi o = 50 ma (10 hz to 100 khz) c l = 200 f v n ? ? 160 46 ? ? vrms current parameters quiescent current on mode v in = [v o + 1] v, i o = 0 ma i qon ? 125 200 a quiescent current on mode sat v in = [v o ? 0.5] v, i o = 0 ma (note 2) 2.5 v suffix 3.0 v suffix 3.3 v suffix 5.0 v suffix i qsat ? ? ? ? 1100 1500 1500 1500 1500 2000 2000 2000 a current limit v in = [v o + 1] v, v o shorted i limit ? 450 ? ma thermal shutdown thermal shutdown ? ? 150 ? c 1. low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 2. quiescent current is measured where the pnp pass transistor is in saturation. v in = [v o ? 0.5] v guarantees this condition.
mc33275, ncv33275 http://onsemi.com 4 definitions load regulation ? the change in output voltage for a change in load current at constant chip temperature. dropout v oltage ? the input/output dif ferential at which the regulator output no longer maintains regulation against further reductions in input voltage. measured when the output drops 100 mv below its nominal value (which is measured at 1.0 v differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. output noise voltage ? the rms ac voltage at the output with a constant load and no input ripple, measured over a specified frequency range. maximum power dissipation ? the maximum total dissipation for which the regulator will operate within specifications. quiescent current ? current which is used to operate the regulator chip and is not delivered to the load. line regulation ? the change in output voltage for a change in the input voltage. the measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. maximum package power dissipation ? the maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150 c. the junction temperature is rising while the difference between the input power (v cc x i cc ) and the output power (v out x i out ) is increasing. depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following: pd t j t a r ja the maximum operating junction temperature t j is specified at 150 c, if t a = 25 c, then p d can be found. by neglecting the quiescent current, the maximum power dissipation can be expressed as: i out p d v cc v out the thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). then you can calculate the power dissipation by subtracting the output power from the input power. all variables are then well known: power dissipation, thermal shutdown temperature and ambient temperature. r ja t j t a p d
mc33275, ncv33275 http://onsemi.com 5 0 3.5 0 300 output voltage (v) input voltage (v) load current (ma) c l = 1.0 f v out = 3.3 v t a = 25 c v in = 4.3 v figure 2. line transient response figure 3. line transient response figure 4. load transient response figure 5. load transient response figure 6. output voltage versus input voltage output voltage change (mv) 50 100 150 200 250 400 100 -100 -200 -500 -600 -700 -0.8 -0.6 -0.4 -0.2 -1.0 0.4 0 0.2 output voltage change (v) v out change load current -750 load current (ma) c l = 33.0 f v out = 3.3 v t a = 25 c v in = 4.3 v 0 250 300 -0.11 -0.16 -0.01 0.14 output voltage change (v) v out change load current 200 -0.06 0.04 0.09 3.0 2.5 2.0 1.5 1.0 0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 i l = 1 ma i l = 250 ma 50 100 150 1 300 dropout voltage (mv) i o , output current (ma) 10 100 1000 250 200 150 100 50 0 0 v in , input voltage (v) time ( s) 20 40 60 80 100 120 140 160 180 200 7 6 5 4 3 2 1 0 -100 -50 0 50 100 150 200 output voltage change (mv) v in v out figure 7. dropout voltage versus output current 0 v in , input voltage (v) time ( s) 50 100 150 200 7 6 5 4 3 2 1 0 -20 -10 0 20 40 50 70 10 30 60 t a = 25 c c l = 33 f i l = 10 ma v out = 3.3 v v in v out -400 -300 0 200 300 350 0.6 0.8 1.0 -650 -550 -450 -350 -250 -150 -50 50 150 250 350 time ( s) time ( s) t a = 25 c c l = 0.47 f i l = 10 ma v out = 3.3 v
mc33275, ncv33275 http://onsemi.com 6 figure 8. dropout voltage versus temperature figure 9. ground pin current versus input voltage figure 10. ground pin current versus ambient temperature figure 11. output voltage versus ambient temperature (v in = v out + 1v) -40 8 0 i t a ( c) v in (volts) 23 8 10 6 4 2 0 7 5 4 3 2 1 0 -20 0 20 40 60 80 100 120 140 i l = 100 ma i l = 250 ma -40 2.5 v temperature ( c) 2.495 2.49 2.485 2.48 2.475 2.47 02585 (ma) gnd 6 i l = 50 ma (volts) out i o = 0 i o = 250 ma -40 300 temperature ( c) 250 200 150 100 50 0 02585 dropout voltage (mv) i l = 10 ma i l = 100 ma i l = 250 ma i l = 300 ma 1 8 12 i (ma) gnd i l = 300 ma i l = 100 ma i l = 50 ma 45 67
mc33275, ncv33275 http://onsemi.com 7 figure 12. output voltage versus ambient temperature (v in = 12 v) figure 13. ripple rejection figure 14. ripple rejection -40 2.5 v temperature ( c) 2.49 2.485 2.48 2.475 2.47 02585 (volts) out i o = 0 i o = 250 ma 2.495 2.465 0.1 70 db frequency (khz) 60 50 40 30 20 10 0 1 10 100 i l = 100 ma i l = 250 ma 0.1 70 db frequency (khz) 60 50 40 30 20 10 0 1 10 100 i l = 10 ma i l = 1 ma
mc33275, ncv33275 http://onsemi.com 8 applications information load c out v ou t v in c in gnd figure 15. typical application circuit the mc33275 regulators are designed with internal current limiting and thermal shutdown making them user ? friendly. figure 15 is a typical application circuit. the output capability of the regulator is in excess of 300 ma, with a typical dropout voltage of less than 260 mv. internal protective features include current and thermal limiting. external capacitors these regulators require only a 0.33 f (or greater) capacitance between the output and ground for stability for 1.8 v, 2.5 v, 3.0 v, and 3.3 v output voltage options. output voltage options of 5.0 v require only 0.22 f for stability. the output capacitor must be mounted as close as possible to the mc33275. if the output capacitor must be mounted further than two centimeters away, then a larger value of output capacitor may be required for stability. a value of 0.68 f or larger is recommended. most type of aluminum, tantalum, or multilayer ceramic will perform adequately. solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25 c. an input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. this will reduce the circuit?s sensitivity to the input line impedance at high frequencies. a 0.33 f or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. the bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator?s input terminals. figure 16 shows the esr that allows the ldo to remain stable for various load currents. 0 100 esr (ohm) load current (ma) 100 200 30 0 10 1.0 0.1 figure 16. esr for v out = 3.0v v out = 3.0 v c out = 1.0 f c in = 1.0 f 50 150 250 stable region applications should be tested over all operating conditions to insure stability. thermal protection internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. when activated, typically at 150 c, the output is disabled. there is no hysteresis built into the thermal protection. as a result the output will appear to be oscillating during thermal limit. the output will turn off until the temperature drops below the 150 c then the output turns on again. the process will repeat if the junction increases above the threshold. this will continue until the existing conditions allow the junction to operate below the temperature threshold. thermal limit is not a substitute for proper heatsinking. the internal current limit will typically limit current to 450 ma. if during current limit the junction exceeds 150 c, the thermal protection will protect the device also. current limit is not a substitute for proper heatsinking. output noise in many applications it is desirable to reduce the noise present at the output. reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise.
mc33275, ncv33275 http://onsemi.com 9 figure 17. sot ? 223 thermal resistance and maximum power dissipation versus p.c.b. copper length 60 80 100 120 140 160 180 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0102030 25 15 5.0 l, length of copper (mm) p d(max) for t a = 50 c r ja , thermal resistance, junction ? to ? air ( cw) p d , maximum power dissipation (w) minimum size pad r ja l l 2.0 oz. copper ??? ??? ??? figure 18. dpak thermal resistance and maximum power dissipation versus p.c.b. copper length 40 50 60 70 80 90 100 0102030 25 15 5.0 l, length of copper (mm) 0.6 0.8 1.0 1.2 1.4 1.6 r ja , thermal resistance, junction ? to ? air ( cw) 0.4 p d , maximum power dissipation (w) l ???? ???? ???? ???? ja minimum size pad p d(max) for t a = 50 c l figure 19. sop ? 8 thermal resistance and maximum power dissipation versus p.c.b. copper length 30 50 70 90 110 170 0.4 0.8 1.2 1.6 3.2 0204050 30 10 l, length of copper (mm) p d(max) for t a = 50 c l l r ja 130 2.0 150 2.4 2.8 ???????? ???????? ???????? graph represents symmetrical layout 2.0 oz. copper 3.0 mm r ja , thermal resistance, junction ? to ? air ( cw) p d , maximum power dissipation (w)
mc33275, ncv33275 http://onsemi.com 10 ordering information device v o typ (v) operating temperature range, tolerance case package marking shipping ? mc33275d ? 2.5 2.5 v (fixed voltage) 1% tolerance at t a = 25 c 2% tolerance at t j from ? 40 c to +125 c 751 soic ? 8 27525 98 units/rail mc33275d ? 2.5g 751 soic ? 8 (pb ? free) 27525 98 units/rail mc33275d ? 2.5r2 751 soic ? 8 27525 2500/tape & reel mc33275d ? 2.5r2g 751 soic ? 8 (pb ? free) 27525 2500/tape & reel mc33275dt ? 2.5 369a dpak 27525 75 units/rail mc33275dt ? 2.5g 369a dpak (pb ? free) 27525g 75 units/rail mc33275dt ? 2.5rk 369a dpak 27525 2500/tape & reel mc33275dt ? 2.5rkg 369a dpak (pb ? free) 27525g 2500/tape & reel mc33275mn ? 2.5r2g 488af dfn8 (pb ? free) 27525 3000/tape & reel mc33275st ? 2.5t3 318e sot ? 223 27525 4000/tape & reel mc33275st ? 2.5t3g 318e sot ? 223 (pb ? free) 27525 4000/tape & reel mc33275d ? 3.0 3.0 v (fixed voltage) 751 soic ? 8 27530 98 units/rail mc33275d ? 3.0g 751 soic ? 8 (pb ? free) 27530 98 units/rail mc33275d ? 3.0r2 751 soic ? 8 27530 2500/tape & reel mc33275d ? 3.0r2g 751 soic ? 8 (pb ? free) 27530 2500/tape & reel mc33275dt ? 3.0 369a dpak 27530 75 units/rail mc33275dt ? 3.0g 369a dpak (pb ? free) 27530g 75 units/rail mc33275dt ? 3.0rk 369a dpak 27530 2500/tape & reel mc33275dt ? 3.0rkg 369a dpak (pb ? free) 27530g 2500/tape & reel mc33275mn ? 3.0r2g 488af dfn8 (pb ? free) 27530 3000/tape & reel mc33275st ? 3.0t3 318e sot ? 223 27530 4000/tape & reel mc33275st ? 3.0t3g 318e sot ? 223 (pb ? free) 27530 4000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc33275, ncv33275 http://onsemi.com 11 ordering information (continued) device v o typ (v) operating temperature range, tolerance case package marking shipping ? mc33275d ? 3.3 3.3 v (fixed voltage) 1% tolerance at t a = 25 c 2% tolerance at t j from ? 40 c to +125 c 1% tolerance at t a = 25 c 751 soic ? 8 27533 98 units/rail mc33275d ? 3.3g 751 soic ? 8 (pb ? free) 27533 98 units/rail mc33275d ? 3.3r2 751 soic ? 8 27533 2500/tape & reel mc33275d ? 3.3r2g 751 soic ? 8 (pb ? free) 27533 2500/tape & reel mc33275dt ? 3.3 369a dpak 27533 75 units/rail mc33275dt ? 3.3g 369a dpak (pb ? free) 27533g 75 units/rail mc33275dt ? 3.3rk 369a dpak 27533 2500/tape & reel mc33275dt ? 3.3rkg 369a dpak (pb ? free) 27533g 2500/tape & reel mc33275st ? 3.3t3 318e sot ? 223 27533 4000/tape & reel mc33275st ? 3.3t3g 318e sot ? 223 (pb ? free) 27533 4000/tape & reel ncv33275st3.3t3g 318e sot ? 223 (pb ? free) 27533 4000/tape & reel mc33275mn ? 3.3r2g 488af dfn ? 8 (pb ? free) 27330 3000/tape & reel mc33275d ? 5.0 5.0 v (fixed voltage) 1% tolerance at t a = 25 c 2% tolerance at t j from ? 40 c to +125 c 1% tolerance at t a = 25 c 751 soic ? 8 27550 98 units/rail mc33275d ? 5.0g 751 soic ? 8 (pb ? free) 27550 98 units/rail mc33275d ? 5.0r2 751 soic ? 8 27550 2500/tape & reel mc33275d ? 5.0r2g 751 soic ? 8 (pb ? free) 27550 2500/tape & reel mc33275dt ? 5.0 369a dpak 27550 75 units/rail mc33275dt ? 5.0g 369a dpak (pb ? free) 27550g 75 units/rail mc33275dt ? 5.0rk 369a dpak 27550 2500/tape & reel mc33275dt ? 5.0rkg 369a dpak (pb ? free) 27550g 2500/tape & reel mc33275mn ? 5.0r2 488af dfn ? 8 27550 3000/tape & reel mc33275mn ? 5.0r2g 488af dfn ? 8 (pb ? free) 27550 3000/tape & reel mc33275st ? 5.0t3 318e sot ? 223 27550 4000/tape & reel mc33275st ? 5.0t3g 318e sot ? 223 (pb ? free) 27550 4000/tape & reel ncv33275st ? 5.0t3 318e sot ? 223 27550 4000/tape & reel ncv33275st ? 5.0t3g 318e sot ? 223 (pb ? free) 27550 4000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc33275, ncv33275 http://onsemi.com 12 package dimensions sot ? 223 (to ? 261) case 318e ? 04 issue m a1 b1 d e b e e1 4 123 0.08 (0003) a l1 c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 soldering footprint h e dim a min nom max min millimeters 1.50 1.63 1.75 0.060 inches a1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 d 6.30 6.50 6.70 0.249 e 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 nom max l1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 h e ? ? e1 0 1 0 0 1 0 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc33275, ncv33275 http://onsemi.com 13 package dimensions soic ? 8 nb case 751 ? 07 issue aj seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
mc33275, ncv33275 http://onsemi.com 14 package dimensions 8 pin dfn, 4x4 mn suffix case 488af ? 01 issue b notes: 1. dimensions and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.25 0.35 d 4.00 bsc d2 1.91 2.21 e 4.00 bsc e2 2.09 2.39 e 0.80 bsc k 0.20 ??? l 0.30 0.50 d b e c 0.15 a c 0.15 2x 2x top view side view bottom view ? ?? ? ?? ?? ?? ?? ? c 0.08 c 0.10 ?? ? ? ? ? ? e 8x l k e2 d2 b note 3 1 4 5 8 8x 0.10 c 0.05 c ab 8x pin one identification *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? 8x 0.63 2.21 2.39 2.75 1 8x 0.40 0.80 pitch 4.30 0.35 dimensions: millimeters
mc33275, ncv33275 http://onsemi.com 15 package dimensions dpak ? 3 dt suffix case 369a ? 13 issue ab d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h ? t ? seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 --- 0.51 --- v 0.030 0.050 0.77 1.27 z 0.138 --- 3.51 --- notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc33275/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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